Communication-Equipment2020-09-17T07:10:56+00:00

In order to shorten the signal transmission distance and reduce the signal transmission loss, the 5G communication board Gradually move towards high-density wiring, fine wire spacing, The development of small aperture, thin profile and high reliability.

Applicable Products

503-Huihe Circuit is a professional PCB circuit board manufacturer

Metallized half-hole circuit board

No copper thorn residue or warpage in the half hole
Daughter board of mother board, saving connectors and space
Applied to Bluetooth module, signal receiver

507-Huihe Circuit is a professional PCB circuit board manufacturer

Impedance circuit board

Strictly control wire width/thickness, medium thickness
Impedance line width tolerance ≤±5%, good impedance matching
Applied to high-frequency and high-speed devices, 5G communication equipment

501-Huihe Circuit is a professional PCB circuit board manufacturer

High precision multilayer circuit board

Minimum line width and line spacing 3/3mil
BGA 0.4pitch, the smallest hole is 0.1mm
Used in industrial control, consumer electronics

Communication industry and PCB products

Communications industry

Major equipment

Required PCB products

PCB features

Wi-Fi

Communication base station

Backplane, high-speed multilayer board, high-frequency microwave board, multifunctional metal substrate

Metal base, large size, high multi-layer, high frequency materials and mixed pressure

Transmission network

OTN transmission equipment, microwave transmission equipment

Backplane, high-speed multilayer board, high-frequency microwave board

High-speed material, large size, high multi-layer, high density, back drill, rigid-flex combination, high-frequency material and mixed pressure

data communication

Routers, switches, service/storage equipment

Backplane, high-speed multilayer board

High-speed material, large size, high multi-layer, high density, back drill, rigid-flex combination

Fixed broadband

OLT, ONU and other fiber-to-the-home equipment

High-speed material, large size, high multi-layer, high density, back drill, rigid-flex combination

Multilayer board, rigid-flex combination

Process difficulty of high frequency and high speed PCB board

difficulty

challenge

Alignment accuracy

Accuracy is tightened, and tolerance convergence between layers is required. The board size becomes more demanding for this convergence requirement

STUB (impedance is not continuous)

STUB is tightened, board thickness fluctuation is extremely challenging, and back drilling technology is required

Impedance accuracy

The etching challenge is great:
1. The etching factor: the smaller the better, the etching accuracy tolerance is 10mil and the line width is controlled by +/-1MIL, and the line width tolerance above 10mil is controlled by +/-10%.
2. Higher requirements for line width, line spacing and line thickness.
3. Others: wiring density, signal layer interference

Increased signal loss demand

It is a big challenge for all copper clad laminates; the tolerance requirements for PCB thickness are high, including length, width, thickness, perpendicularity, bow and twist, etc.

Size gets bigger

Machinability deteriorates, maneuverability deteriorates, and blind holes need to be buried 1. Cost increase 2. Difficulty in alignment accuracy

The number of layers becomes higher

Features such as denser lines and vias, larger cell size, thinner dielectric layer, etc., more stringent requirements for inner layer space, interlayer alignment, impedance control, and reliability

PCB demand composition of communication equipment and mobile terminals

communication device

Single/double panel
11.96%
4 layers
17.62%
6 layers
12.49%
Over 18 layers
35.18%
Over 18 layers
7.26%
HDI
3.83%
Flexible board
2.73%
Package substrate
8.95%

Mobile terminal

Single/double panel
0%
4 layers
0.34%
6 layers
1.07%
Over 18 layers
0%
Over 18 layers
0%
HDI
50.68%
Flexible board
47.92%
Package substrate
26.36%

Accumulated experience in manufacturing communication board of Huihe Circuit

High density requirements:

The influence of crosstalk (noise) will decrease as the line width/spacing (L/S) shrinks.

Strict impedance requirements:

Characteristic impedance matching is the most basic requirement for high-frequency microwave boards. The greater the impedance, the greater the ability to prevent the signal from penetrating the dielectric layer, the faster the signal transmission and the smaller the loss.

Transmission line production accuracy is high:

The transmission of high-frequency signals has strict requirements on the characteristic impedance of the printed wire, that is, the production accuracy of the transmission line is generally ±lmil, and the edges of the transmission line must be very neat, and no burrs, gaps, or repairs are allowed. line.

Mechanical processing requirements:

First, the high-frequency microwave board material is very different from the epoxy glass cloth material of the printed board in terms of machining; secondly, the processing accuracy of the high-frequency microwave board is higher than that of the printed board. Many, the general shape tolerance is ±0.1mm (in the case of high accuracy, the shape tolerance is ±0.05mm).

Mixed pressure:

 The mixed use of high-frequency substrates (PTFE-based) and high-speed substrates (PPE-based) makes the high-frequency and high-speed circuit board not only have a large conduction area, but also have a stable dielectric constant, high dielectric shielding requirements, and high temperature resistance. At the same time, it should be solved that the differences in the bonding force and thermal expansion coefficient between the two different plates lead to the undesirable phenomenon of delamination and mixed pressure warping during the processing.

The coating uniformity requirements are high:

The characteristic impedance of the high-frequency microwave board transmission line directly affects the transmission quality of the microwave signal. The characteristic impedance has a certain relationship with the thickness of the copper foil. Especially for microwave plates with hole metallization, the plating thickness not only affects the total copper foil thickness, but also affects the accuracy of the wire after etching, so the size and uniformity of the plating thickness Need to be strictly controlled.

Laser micro-via processing:

The important feature of high-density boards for communication is the micro-via with blind/buried via structure (aperture ≤0.15mm). The formation of tiny vias is currently mainly laser processing. The ratio of the diameter of the via hole to the diameter of the land may vary from supplier to supplier. The ratio of the diameter of the via hole to the connecting plate is related to the accuracy of drilling positioning. The more stacks, the greater the deviation may be. At present, the target positioning is tracked layer by layer. For high-density wiring, there have been vias without land.

Surface treatment is more complicated:

As the frequency increases, the choice of surface treatment becomes more and more important; a thin coating with good electrical conductivity has the least impact on the signal. The “roughness” of the wire must match the transmission thickness that the transmission signal can accept, otherwise it is easy to produce serious signal “standing waves” and “reflections”. The molecular inertness of special substrates such as PTFE makes it difficult to combine with copper foil. Special surface treatment is required to increase the surface roughness or add a layer of adhesive film between the copper foil and PTFE to improve the bonding force.

Why choose Huihe Circuit?

7-Huihe Circuits professional PCB circuit board manufacturer

      Huihe Circuit has a production workshop of 12,000 square meters, with more than 20 senior engineers now and a monthly production capacity of 35,000 square meters. It is a professional manufacturer of PCB circuit boards. Huihe Circuits has obtained UL, ISO9001, IATF16949, ISO14001, ISO13485, OHSAS18001, RoHS, CQC and other management system and product certifications, and conforms to IPC international inspection standards.

6-Huihe Circuit is a professional PCB circuit board manufacturer

      Huihe Circuits has been constantly striving to improve the quality of PCB circuit boards to be close to flawless. Huihe Circuits not only has a strict and complete quality control system, but also has sophisticated production and testing equipment. Huihe Circuit’s professional and thoughtful service capabilities and complete quality control system have won Huihe Circuit a good reputation among customers.

ISO14001, ISO13485, OHSAS18001, RoHS, CQC and other management system and product certifications, and conforms to IPC international inspection standards.

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High-quality imported raw materials to ensure product quality from the source

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