Process-Capacity2020-09-19T02:32:21+00:00

Items

Mass production capabilities

Prototyping capabilities

Layers

1-20

2-28

Base materals

FR-4,High-frequency

Maximum size

500mm×600mm

580mm×800mm

Dimension accuracy

±0.13mm

±0.1mm

Thickness range

0.20-4.00mm

0.20-6.00mm

Thickness tolerance(THK<0.8mm)

±8%

±8%

Thickness tolerance(THK<0.8mm)

±10%

±10%

Dielectric thickness

0.07-3.20mm

0.07-5.00mm

Minimum line width

0.1mm

0.075mm

Minimum space

0.1mm

0.075mm

Outer copper thickness

37-175um

35-280um

Inner copper thickness

17-175um

17-280um

Drill hole(Mechanical)

0.15-6.35mm

0.15-6.35mm

Finished hole(Mechanical)

0.10-6.30mm

0.10-6.30mm

Diameter tolerance(Mechanical)

±0.075mm

±0.075mm

Hole position tolerance(Mechanical)

±0.05mm

±0.05mm

Aspect ratio

10:1

13:1

Solder mask type

LPI

LPI

Minimum solder mask bridge width

0.1mm

0.08mm

Minimum solder mask clearance

0.075mm

0.05mm

Plug hole diameter

0.25-0.50mm

0.25-0.60mm

Impedance control tolerance

±10%

±10%

Surface finish

HASL,LF-HASL,ENIG,Imm Tin,Imm Ag,OSP,Gold Finger